SubstancesConflict minerals

3TG: Tin, Tantalum, Tungsten, Gold

The four conflict minerals. In electronics, tin goes into solder, tantalum into capacitors, tungsten into alloys and weights, and gold into plating and bonding.

Updated
2026-06-12

Overview

3TG is shorthand for the four conflict minerals tin, tantalum, tungsten and gold. They share a regulatory label because all four can be mined in conflict-affected and high-risk areas, where the trade can fund armed groups. Each is also a workhorse metal in electronics with a distinct role.

Tin
Solder
Tantalum
Capacitors
Tungsten
Alloys and weights
Gold
Plating and bonding

Why they're tracked

Because these metals can originate in conflict-affected areas, they sit at the centre of conflict-minerals due diligence. Companies trace their sources back through the supply chain to the smelters and refiners, and they report the results using the CMRT, the Conflict Minerals Reporting Template.

Key point

The "3T" in 3TG covers tin, tantalum and tungsten, and the "G" is gold. All four are tracked together because of where they can be mined, not because of any shared chemistry.

Where they appear in products

Tin forms the bulk of the solder that joins components to boards. Tantalum gives compact, stable capacitors. Tungsten lends hardness to alloys and density to small weights. Gold provides corrosion-free plating on contacts and the fine bonding wires inside chips. Collecting this information feeds the broader material declaration a product carries.

Note: general educational information, not legal advice. Check the official source before relying on it.

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conflict mineralsdue diligenceCMRTelectronics